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Rich Grise
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Winfield Hill
Guest
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Posted:
Thu Feb 10, 2005 5:17 pm Post subject:
Re: Soldering TQFSOPNCD packages ;-) |
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Rich Grise wrote...
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Is this how you're supposed to R&R them microchip thingies?
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Not with that big iron!
| Quote: | http://www.neodruid.com/images/dscf0150.jpg
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Ah, the famous Davicom 48-pin dm9161 10base-T 100base-T physical-
layer IC. http://www.davicom.com.tw/eng/products/dm9161.htm
--
Thanks,
- Win |
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DaveC
Guest
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Posted:
Thu Feb 10, 2005 5:51 pm Post subject:
Re: Soldering TQFSOPNCD packages ;-) |
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Winfield Hill <hill_a@t_rowland-dotties-harvard-dot.s-edu> wrote in
news:cuffsk0e43@drn.newsguy.com:
| Quote: | http://www.neodruid.com/images/dscf0150.jpg
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I've never seen such a shiny electrolytic before.
DaveC
----== Posted via Newsfeeds.Com - Unlimited-Uncensored-Secure Usenet News==----
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John Woodgate
Guest
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Posted:
Thu Feb 10, 2005 5:57 pm Post subject:
Re: Soldering TQFSOPNCD packages ;-) |
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I read in sci.electronics.design that Rich Grise <richgrise@example.net>
wrote (in <pan.2005.02.10.10.16.57.99342@example.net>) about 'Soldering
TQFSOPNCD packages ;-)', on Thu, 10 Feb 2005:
lead-outs at once.
--
Regards, John Woodgate, OOO - Own Opinions Only.
The good news is that nothing is compulsory.
The bad news is that everything is prohibited.
http://www.jmwa.demon.co.uk Also see http://www.isce.org.uk |
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Frank Bemelman
Guest
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Posted:
Thu Feb 10, 2005 6:01 pm Post subject:
Re: Soldering TQFSOPNCD packages ;-) |
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"DaveC" <bobason456@hotmail.com> schreef in bericht
news:Xns95FA82A74AA8ohirohotmailcom@38.119.85.36...
And curled traces, like the one from C5 to L1. Most of
the others are 45/45 degrees.
--
Thanks, Frank.
(remove 'q' and 'invalid' when replying by email) |
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Boris Mohar
Guest
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John Woodgate
Guest
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Posted:
Thu Feb 10, 2005 6:48 pm Post subject:
Re: Soldering TQFSOPNCD packages ;-) |
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I read in sci.electronics.design that Boris Mohar <borism_-void-
_@sympatico.ca> wrote (in <fkkm01l76unjc731jg2c6p76uflbfsb029@4ax.com>)
about 'Soldering TQFSOPNCD packages ;-)', on Thu, 10 Feb 2005:
| Quote: | Of course you need a10x- 30x stereo microscope
with zoom.
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You also need a daughter.
--
Regards, John Woodgate, OOO - Own Opinions Only.
The good news is that nothing is compulsory.
The bad news is that everything is prohibited.
http://www.jmwa.demon.co.uk Also see http://www.isce.org.uk |
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Rene Tschaggelar
Guest
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Posted:
Thu Feb 10, 2005 7:14 pm Post subject:
Re: Soldering TQFSOPNCD packages ;-) |
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Boris Mohar wrote:
| Quote: | Of course you need a10x- 30x stereo microscope with zoom.
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A pair of 4 dioptries glasses are suffiecient
Rene
--
Ing.Buero R.Tschaggelar - http://www.ibrtses.com
& commercial newsgroups - http://www.talkto.net |
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Boris Mohar
Guest
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Posted:
Thu Feb 10, 2005 7:43 pm Post subject:
Re: Soldering TQFSOPNCD packages ;-) |
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On Thu, 10 Feb 2005 12:48:15 +0000, John Woodgate
<jmw@jmwa.demon.contraspam.yuk> wrote:
| Quote: | I read in sci.electronics.design that Boris Mohar <borism_-void-
_@sympatico.ca> wrote (in <fkkm01l76unjc731jg2c6p76uflbfsb029@4ax.com>)
about 'Soldering TQFSOPNCD packages ;-)', on Thu, 10 Feb 2005:
Of course you need a10x- 30x stereo microscope
with zoom.
You also need a daughter.
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Of course. A well paid daughter.
--
Boris Mohar |
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Leon Heller
Guest
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Posted:
Thu Feb 10, 2005 9:27 pm Post subject:
Re: Soldering TQFSOPNCD packages ;-) |
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"Winfield Hill" <hill_a@t_rowland-dotties-harvard-dot.s-edu> wrote in
message news:cuffsk0e43@drn.newsguy.com...
| Quote: | Rich Grise wrote...
Is this how you're supposed to R&R them microchip thingies?
Not with that big iron!
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Perhaps he's drag soldering, a large tip works better for that than a small
one. It does look too big even for that, though.
Leon |
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Guest
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Posted:
Thu Feb 10, 2005 10:07 pm Post subject:
Re: Soldering TQFSOPNCD packages ;-) |
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I think he's heating the lead close to the package and applying the
solder down at the PCB land. Eventually the lead gets hot enough to
melt the solder and it wets the land. You don't need a particularly
fine iron to do this. In fact the shape he's hand-carved in that tip is
much the same shape I prefer: very pointy, steep angle on the tip. Long
thin tips don't transfer heat well enough. |
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John Larkin
Guest
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Posted:
Thu Feb 10, 2005 10:44 pm Post subject:
Re: Soldering TQFSOPNCD packages ;-) |
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On Thu, 10 Feb 2005 15:27:26 -0000, "Leon Heller"
<leon_heller@hotmail.com> wrote:
| Quote: | "Winfield Hill" <hill_a@t_rowland-dotties-harvard-dot.s-edu> wrote in
message news:cuffsk0e43@drn.newsguy.com...
Rich Grise wrote...
Is this how you're supposed to R&R them microchip thingies?
Not with that big iron!
Perhaps he's drag soldering,
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or trolling.
John |
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Rob Gaddi
Guest
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Posted:
Thu Feb 10, 2005 11:53 pm Post subject:
Re: Soldering TQFSOPNCD packages ;-) |
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Speaking of which, has anyone found a good way of dealing with those
thermally enhanced packages where they sink the lead frame to a pad
underneath the chip? I'm using the aforementioned heat gun + prayer
technique, combined with preheating the board until the solder paste is
just starting to melt, then throwing the chip on, but I'm still getting
a somewhat unacceptable casualty rate. |
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Boris Mohar
Guest
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Posted:
Fri Feb 11, 2005 12:33 am Post subject:
Re: Soldering TQFSOPNCD packages ;-) |
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On Thu, 10 Feb 2005 11:53:48 -0600, Rob Gaddi <rgaddi@bcm.YUMMYSPAMtmc.edu>
wrote:
| Quote: |
Now tell me how to hand solder this:
http://focus.ti.com/lit/ml/mxbg003a/mxbg003a.pdf
Dimensions are in mm.
Link to TI packaging info http://focus.ti.com/general/docs/packaging.jsp
Heat gun and prayer.
Speaking of which, has anyone found a good way of dealing with those
thermally enhanced packages where they sink the lead frame to a pad
underneath the chip? I'm using the aforementioned heat gun + prayer
technique, combined with preheating the board until the solder paste is
just starting to melt, then throwing the chip on, but I'm still getting
a somewhat unacceptable casualty rate.
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For hand assembled boards I extend the thermal pad outside of the boundaries
of the chip where it can be accessed by soldering iron or by placing a some
thermal vias and a copper pad on the opposite side. You can now hand solder
the pad and solder will go fill up vias and melt the solder paste on the
other side.
See http://focus.ti.com/lit/an/slma002/slma002.pdf
also http://www.ti.com/sc/docs/package/related.htm
Regards,
Boris Mohar
Got Knock? - see:
Viatrack Printed Circuit Designs (among other things) http://www.viatrack.ca |
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Rich Grise
Guest
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Posted:
Fri Feb 11, 2005 6:11 am Post subject:
Re: Soldering TQFSOPNCD packages ;-) |
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On Thu, 10 Feb 2005 08:07:44 -0800, larwe wrote:
| Quote: |
Is this how you're supposed to R&R them microchip thingies?
http://www.neodruid.com/images/dscf0150.jpg
I think he's heating the lead close to the package and applying the
solder down at the PCB land. Eventually the lead gets hot enough to
melt the solder and it wets the land. You don't need a particularly
fine iron to do this. In fact the shape he's hand-carved in that tip is
much the same shape I prefer: very pointy, steep angle on the tip. Long
thin tips don't transfer heat well enough.
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Yikes! Actually, it was supposed to be a joke. I wouldn't try to solder
anything that small in the first place, and I certainly wouldn't use that
iron!
I have a RS "princess" or something that I'd use for smaller work anyway.
:-)
Thanks!
Rich |
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